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Rehm Condenso Reflow Condensation Soldering


Simply. More. Technique.

In fact, Condenso from Rehm Thermal Systems is a state-of-the-art condensation reflow soldering solution. Addressing the complex demands of lead-free solder alloys for PCBs with a large thermal mass, Condenso will solder your most difficult PCBs quickly, void free and reliably for maximum return on investment.

System advantages

Low operating costs
Profile longitudinal / lateral ±2 K
Ideal for PCBs with large thermal mass
Void-free thanks to vacuum option
Simple, accurate temperature profiling
Horizontal conveyor
Constant temperature
Inert gas soldering

Specifications:

Model   L * W * H
XM 3100*2030*1770 mm
XP 4100*2030*1770 mm
XPHS 4100*2030*1770 mm

 


Flat soldering (1cm2)
without vacuum

Flat soldering (1cm2)
with vacuum
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